LOCALIZED PARYLENE-C BONDING FOR MICRO PACKAGING AND CELL ENCAPSULATION USING REACTIVE MULTILAYER FOILS

摘要

This paper described a novel physiologicallyrncompatible wafer bonding technique forrnbio-microelectromechnical systems (bio-MEMS)rnpackaging. Room temperature bonding was performedrnbetween Parylene-C and silicon wafers with a thinrnParylene-C coating using reactive Ni/Al multilayer foils asrnlocalized heaters. Live NIH 3T3 mouse fibroblast cellsrnwere encapsulated in the package and they survived thernbonding process owing to the localization of heating. Arnnumerical model was developed to predict the temperaturernevolutions in the parylene layers, silicon wafer and thernencapsulated liquid during the bonding process. Thernsimulation results were in agreement with the cellrnencapsulation experiment revealing that localized heatingrnoccurred in this bonding approach. This study proved thernfeasibility of reactive multilayer foil bonding technique forrnbroad applications in packaging bio-MEMS andrnmicrofluidic systems.