首页> 外文会议>Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09 >Micro Thermoforming of nanostructured polymer films: A new bonding method for the integration of nanostructures in 3-dimensional cavities
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Micro Thermoforming of nanostructured polymer films: A new bonding method for the integration of nanostructures in 3-dimensional cavities

机译:纳米结构聚合物薄膜的微热成型:将纳米结构整合到3维腔体中的新结合方法

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In this paper an approach will be presented to integrate selective nanostructured surfaces in 3-dimensional cavities. For this purpose, the technologies of nanoimprinting, micro thermoforming, and thermal bonding will be combined. In a first step the nanostructures are patterned onto the surface of polymer films by nanoimprinting. In a second step they are brought into a 3-dimensional form by micro thermoforming. During this micro thermoforming step, a thermal bonding process is accomplished in parallel. Geometrical modifications of the nanostructures due to the 3-dimensional stretching of the polymer film are measured, described, and compared with an analytical model.
机译:在本文中,将提出一种在3维腔体中集成选择性纳米结构表面的方法。为此,将结合纳米压印,微热成型和热粘合技术。第一步,通过纳米压印将纳米结构图案化到聚合物膜的表面上。在第二步中,通过微热成型将它们制成3维形式。在此微热成型步骤中,并行完成热粘合过程。测量,描述了由于聚合物膜的3维拉伸而导致的纳米结构的几何修饰,并将其与分析模型进行了比较。

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