A multiple supply voltage based power reduction method in 3-D ICs considering process variations and thermal effects

摘要

In this paper, a grid-based multiple supply voltage (MSV) assignment method is presented to statistically minimize the total power consumption of 3-D IC. This method consists of a statistical electro-thermal simulator to get the mean and variance of on-chip, a thermal-aware statistical static timing analysis (SSTA) to take into account the thermal effect on circuit timing, the statistical power delay sensitivity-slack product to be the optimization criterion, and an incremental update of statistical timing to save the runtime. The experimental results demonstrate the effectiveness of the developed methodology and indicate that the consideration of the thermal effect in the circuit simulation is imperative.