Profiling of the Mechanical Properties of Ultralow-k Films Using Nanoindentation Techniques

摘要

Several nanoindentation techniques were applied to the surface, the reverse side and cross-sections of PECVD ultralow-k (ULK) film stacks to characterize their elasto-plastic properties quantitatively. Results showed good agreement of the reduced modulus (E_r) values measured from above and on cross-sections, respectively. E_r decreased by 10-22% from the upper to the lower surface of the films. This gradient suggests that UV light absorption inside the film leads to slightly reduced curing at the rear side of the films compared to the surface of the ULK layers. Both quasi-static nanoindentation and dynamic mechanical mapping showed this trend. It is demonstrated that quantitative mechanical mapping can be performed with a lateral resolution < 100nm. Slight local variations of E_r were detected on ULK/SiC_xN_y films stacked on top of Cu-low-k interconnect structures.