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EIS modeling of films of bis-(TRI-ethoxysil ylpropyl) tetrasul-fide on Al 2024-T3 substrates

机译:Al 2024-T3衬底上的双(三乙氧基甲硅烷基丙基)四硫化物薄膜的EIS建模

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摘要

Thin films of the hydrolyzed silane bis-(triethoxysilylpropyl)tetrasulfide (sulfane) were depo sited on alkaline-cleaned Al 2024-T3 panels and investigated by Electrochemical Impedance Spectros-copy (EIS) using the non-corrosive electrolyte 0.5 M K_2SO_4. The effecu0014s of continuous immersion of the films in this electrolyte and curing the films at room temperature or at 100!C in air were studied. An equivalent circuit is proposed that fits the experimental data very well. It is demonstrated that by this approach the hydrolysis of the ester groups to silanol groups and condensation of the latter to siloxane units in the film can be observed. Evidence is presented. For the formation of an interfacial film between the crosslinked silane film and the aluminum oxide. It is concluded that EIS in a non-corrosive electrolyte is a useful method for studying the stability of silance films formed on metals and can contribute to determining the optimum conditions for depositing silane films on metals for corrosion protection.
机译:将水解后的硅烷双-(三乙氧基甲硅烷基丙基)四硫化物(亚砜)薄膜沉积在经碱清洁的Al 2024-T3板上,并通过电化学阻抗谱(EIS)使用非腐蚀性电解质0.5 M K_2SO_4进行研究。研究了将膜连续浸入该电解质并在室温或100°C的空气中固化膜的效果。提出了一个非常适合实验数据的等效电路。已经证明,通过这种方法,可以观察到酯基团水解成硅烷醇基团并且后者在薄膜中缩合为硅氧烷单元。提供证据。为了在交联的硅烷膜和氧化铝之间形成界面膜。结论是,非腐蚀性电解质中的EIS是研究金属上形成的沉默膜稳定性的有用方法,并且有助于确定在金属上沉积硅烷膜以进行腐蚀防护的最佳条件。

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