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Direct laser marking on ROM media for identification

机译:在ROM介质上直接激光打标以进行识别

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摘要

In order to attempt the direct laser marking for ROM media like a compact disk for identification, various laser heating was carried out against a thin metallic film in the transparent medium. As heat sources for the processing, a semiconductor laser excitation YAG laser (532 nm wavelength of second harmonic, max 150 mW), semiconductor lasers (780 nm, up to 2 W), and an Ar ion laser (514.5 nm, max 2000 mW), etc. were used. The media under consideration on laser marking is an aluminum thin film reflector layer, which was sandwiched between a polycarbonate (PC) of 1.2 mm and a protection film of 5 μm thickness. The aluminum thin film (Al) is 100 nm in thickness. The obtained laser marking sizes were less than 1 μm and were evaluated using SEM and AFM. The observation samples inside a transparency resin were obtained by tearing off a protection film, and the surfaces of the bared PC and protection film were examined. The surface conditions and cross sections of laser-marking area were observed. It seems that the heated aluminum thin film were melted and a hole arose. Then a cavity was not observed from SEM cross-section observation in the marking area. It became clear that the holes were filled with PC by SEM and AFM observation. These results indicate the possibility of heat localization at the Al-PC interface and also significant heat penetration into the PC substrate itself.
机译:为了尝试对诸如光盘之类的ROM介质进行直接激光标记以进行识别,对透明介质中的金属薄膜进行了各种激光加热。作为处理的热源,半导体激光激发YAG激光(二次谐波的532 nm波长,最大150 mW),半导体激光(780 nm,最大2 W)和Ar离子激光(514.5 nm,最大2000 mW) )等。正在考虑进行激光标记的介质是铝薄膜反射层,该层夹在1.2 mm的聚碳酸酯(PC)和5μm厚度的保护膜之间。铝薄膜(Al)的厚度为100nm。获得的激光标记尺寸小于1μm,并使用SEM和AFM进行评估。通过撕下保护膜获得透明树脂内部的观察样品,并且检查裸露的PC和保护膜的表面。观察激光打标区域的表面状况和横截面。似乎加热的铝薄膜熔化并出现孔。然后,在标记区域中通过SEM截面观察未观察到空腔。通过SEM和AFM观察,显然孔被PC填充。这些结果表明,热量可能会在Al-PC界面处定位,并且还会有大量热量渗透到PC基板本身中。

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