首页> 外文会议>Conference on Optoelectronic Interconnects, Integrated Circuits, and Packaging Jan 22-25, 2002 San Jose, USA >Multi-channel free-space intra-chip optical interconnections: combining plastic micro-optical modules and VCSEL based OE-FPGA
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Multi-channel free-space intra-chip optical interconnections: combining plastic micro-optical modules and VCSEL based OE-FPGA

机译:多通道自由空间芯片内光学互连:结合塑料微光学模块和基于VCSEL的OE-FPGA

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We fabricated and replicated in semiconductor compatible plastics a multi-channel free-space optical interconnection module designed to establish intra-chip interconnections on an Opto-Electronic Field Programmable Gate Array (OE-FPGA). The micro-optical component is an assembly of a refractive lenslet-array and a high-quality microprism. Both components were prototyped using deep lithography with protons and were monolithically integrated using a vacuum casting replication technique. The resulting 16 channel module shows optical transfer efficiencies of 50% and inter-channel cross-talks as low as ―22 dB. These characteristics are sufficient to establish multi-channel intra-chip interconnects with OE-FPGA's. The OE-FPGA we used was designed within a European co-founded MEL-ARI consortium, working towards a manufacturable solution for optical interconnects between CMOS IC's. The optoelectronic chip combines fully functional FPGA digital logic with the drivers, receivers and flip-chipped optoelectronic components. It features 2 optical inputs an 2 optical outputs per FPGA cell, amounting to 256 photonic I/O links based on multi-mode 980 nm VCSELs and InGaAs detectors. With a careful alignment of the micro-optical free-space module above the OE-VLSI chip, we demonstrated for the first time to our knowledge a multi-channel free-space intra-chip optical interconnection. Data-communication was achieved with 4 simultaneous channels working at 10Mb/s. The bitrate was limited by the chiptester. Notwithstanding the use of non-aggressive 0.6μm CMOS technology the FPGA will provide an 80 Mbit/s information rate per channel using manchester encoded links. The whole chip therefore has in principle a peak aggregate signalling rate of approximately 20 GBit/s. This first demonstration paves the way for a practical solution to solve the electronic intra-chip interconnect bottleneck with low-cost mass-producible chip-compatible plastic micro-optical modules.
机译:我们在半导体兼容塑料中制造并复制了一个多通道自由空间光学互连模块,该模块旨在在光电现场可编程门阵列(OE-FPGA)上建立芯片内互连。微光学组件是折射小透镜阵列和高质量微棱镜的组合。这两个组件都使用具有质子的深光刻技术进行原型制作,并使用真空铸造复制技术进行整体集成。最终的16通道模块显示出50%的光传输效率,通道间串扰低至―22 dB。这些特性足以与OE-FPGA建立多通道芯片内互连。我们使用的OE-FPGA是在欧洲共同创立的MEL-ARI联盟内部设计的,致力于为CMOS IC之间的光学互连提供可制造的解决方案。光电芯片将功能齐全的FPGA数字逻辑与驱动器,接收器和倒装的光电组件结合在一起。它具有每个FPGA单元2个光输入和2个光输出,基于980 nm多模VCSEL和InGaAs检测器,总计256条光子I / O链路。通过在OE-VLSI芯片上方仔细对准微光学自由空间模块,我们首次展示了多通道自由空间芯片内光学互连的知识。通过同时以10Mb / s的速度工作的4个通道实现了数据通信。比特率受芯片测试仪的限制。尽管使用了非侵略性的0.6μmCMOS技术,FPGA仍将使用曼彻斯特编码的链接提供每通道80 Mbit / s的信息速率。因此,整个芯片原则上具有大约20 GBit / s的峰值集合信令速率。首次演示为解决低成本低成本可大规模生产的芯片兼容塑料微光学模块的电子芯片内部互连瓶颈铺平了道路。

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