首页> 外文会议>Conference on Optoelectronic Integration on Silicon; 20040127-20040128; San Jose,CA; US >200 Mbps-OPTICAL INTEGRATED CIRCUIT DESIGN AND FIRST ITERATION REALIZATIONS IN 1.2 AND 0.8 MICRON Bi-CMOS TECHNOLOGY
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200 Mbps-OPTICAL INTEGRATED CIRCUIT DESIGN AND FIRST ITERATION REALIZATIONS IN 1.2 AND 0.8 MICRON Bi-CMOS TECHNOLOGY

机译:采用1.2和0.8微米Bi-CMOS技术的200 Mbps光学集成电路设计和首次迭代实现

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A prototype Silicon CMOS Optical Integrated Circuit (Si CMOS OEIC) was designed and simulated using standard 0.8 micron Bi-CMOS silicon integrated circuit technology. The circuit consisted of an integrated silicon light emitting source, an optical wave-guiding structure, two integrated optical detectors and two high-gain CMOS trans-impedance analogue amplifiers. Simulations with MicroSim PSpice software predict a utilizable bandwidth capability of up to 220 MHz for the trans-impedance amplifier for detected photo-currents at the input of the amplifier in the range of 1 nA to 100 nA and driving a 10mV to 1 V signal into a 100 kΩ load. First iteration OEIC structures were realised in 1.2 micron CMOS technology for various source-waveguide-detector arrangements. Current signal ranging from 1 nA to 1 micro-amp was detected at detectors. The technology seems favorable for first-iteration implementation for digital communications on chip up to 200Mbps.
机译:使用标准的0.8微米Bi-CMOS硅集成电路技术设计和仿真了原型硅CMOS光学集成电路(Si CMOS OEIC)。该电路由一个集成的硅发光源,一个光波导结构,两个集成的光检测器和两个高增益CMOS跨阻抗模拟放大器组成。使用MicroSim PSpice软件进行的仿真预测,跨阻抗放大器的可利用带宽能力可达220 MHz,用于检测放大器输入端检测到的光电流,范围为1 nA至100 nA,并驱动10mV至1 V信号进入100kΩ负载。首次迭代OEIC结构是在1.2微米CMOS技术中实现的,用于各种源波导探测器配置。在检测器上检测到的电流信号范围为1 nA至1微安。该技术似乎对于首次实现高达200Mbps的片上数字通信非常有利。

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