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Wafer-fused orientation-patterned GaAs

机译:晶圆融合取向图形的砷化镓

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摘要

The fabrication of thick orientation-patterned GaAs (OP-GaAs) films is reported using a two-step process where an OP-GaAs template with the desired crystal domain pattern was prepared by wafer fusion bonding and then a thick film was grown over the template by low pressure hydride vapor phase epitaxy (HVPE). The OP template was fabricated using molecular beam epitaxy (MBE) followed by thermocompression wafer fusion, substrate removal, and lithographic patterning. On-axis (100) GaAs substrates were utilized for fabricating the template. An approximately 350 μm thick OP-GaAs film was grown on the template at an average rate of ~70 μm/hr by HVPE. The antiphase domain boundaries were observed to propagate vertically and with no defects visible by Nomarski microscopy in stain-etched cross sections. The optical loss at ~2 μm wavelength over an 8 mm long OP-GaAs grating was measured to be no more than that of the semi-insulating GaAs substrate. This template fabrication process can provide more flexibility in arranging the orientation of the crystal domains compared to the Ge growth process and is scalable to quasi-phase-matching (QPM) devices operating from the IR to terahertz frequencies utilizing existing industrial foundries.
机译:使用两步工艺报告了厚取向图案化的GaAs(OP-GaAs)膜的制造,其中通过晶片熔融结合制备了具有所需晶畴图案的OP-GaAs模板,然后在模板上生长了厚膜通过低压氢化物气相外延(HVPE)。 OP模板是使用分子束外延(MBE),热压晶片融合,衬底去除和光刻图案制造的。同轴(100)GaAs衬底被用于制造模板。通过HVPE,以约70μm/ hr的平均速率在模板上生长约350μm厚的OP-GaAs膜。观察到反相畴边界垂直传播,并且在污渍蚀刻的横截面中没有通过Nomarski显微镜可见的缺陷。经测量,在8 mm长的OP-GaAs光栅上,在〜2μm波长处的光损耗不超过半绝缘GaAs衬底的光损耗。与Ge生长工艺相比,这种模板制造工艺可以在排列晶畴的方向上提供更大的灵活性,并且可以扩展到使用现有工业铸造厂从IR到太赫兹频率工作的准相位匹配(QPM)器件。

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