首页> 外文会议>Conference on Laser Micromachining for Optoelectronic Device Fabrication Oct 30, 2002 Brugge, Belgium >Pulsed laser machining and polishing of silica micro-optical components using a CO_2 laser and an acousto-optic modulator
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Pulsed laser machining and polishing of silica micro-optical components using a CO_2 laser and an acousto-optic modulator

机译:使用CO_2激光和声光调制器对二氧化硅微光学元件进行脉冲激光加工和抛光

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摘要

Laser ablation and laser smoothing of silica is investigated as a method of manufacturing custom micro-optics for use with high-power, diode laser arrays. A highly flexible machining regime has been identified that uses 30 to 60 μs square pulses, generated from a stabilised CO_2 laser by an acousto-optical modulator (AOM). Refractive optical surfaces with apertures of 1 mm x 1 mm have been generated by the multi-pulse, raster scanning method with cut depths in the range of 10 to 30 μm controlled to an accuracy of better than 150 nm. A subsequent laser "fire polishing" step to smooth out the surface, using the same laser system as for machining, but in a long pulse mode at an energy fluence that just avoids further ablation of the surface. The objective of the research is to produce rapid prototyping of arrays of refractive elements, to avoid the tooling or mask-writing steps of alternative methods. A particular interest is in the generation of corrective optical elements to improve the beam quality of arrays of diode laser bars.
机译:作为制造用于高功率二极管激光器阵列的定制微光学器件的方法,对二氧化硅的激光烧蚀和激光平滑进行了研究。已经确定了一种高度灵活的加工方案,该方案使用30至60μs的平方脉冲,该脉冲由声光调制器(AOM)从稳定的CO_2激光器产生。通过多脉冲光栅扫描方法已经生成了孔径为1 mm x 1 mm的折射光学表面,其切割深度控制在10至30μm范围内,精度优于150 nm。随后的激光“火抛光”步骤使用与加工相同的激光系统使表面光滑,但是以长脉冲模式以能量通量使用,从而避免了表面的进一步烧蚀。该研究的目的是生产折射元件阵列的快速原型,以避免替代方法的加工或掩模写入步骤。特别令人感兴趣的是产生校正光学元件以改善二极管激光棒阵列的光束质量。

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