首页> 外文会议>Conference on laser applications in microelectronic and optoelectronic manufacturing VII; 20090126-29; San Jose, CA(US) >Enhancement of cleaning efficiency by geometrical confinement of plasma expansion in the laser shock cleaning process for nanoscale contaminant removal
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Enhancement of cleaning efficiency by geometrical confinement of plasma expansion in the laser shock cleaning process for nanoscale contaminant removal

机译:通过激光冲击清洗工艺中等离子体膨胀的几何限制来提高清洁效率,以去除纳米级污染物

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It has been shown that the laser shock cleaning (LSC) process is effective for removing nanoscale particles from solid surfaces and thus has various potential applications in microelectronic manufacturing. In this work, we propose a simple method to amplify the shock wave intensity generated by laser-induced breakdown (LIB) of air. The suggested scheme employs a plane shock wave reflector which confines the plasma expansion in one direction. As the half of the LIB-induced shock wave is reflected by the reflector, the intensity of the shock wave propagating in the opposite direction is increased significantly. Accordingly, the enhanced shock wave can remove smaller particles from the surface than the existing LSC process. The LSC process under geometrical confinement is analyzed both theoretically and experimentally. Numerical computation of the plasma/shock behavior shows about two times pressure amplification for the plane geometry. Experiments confirm that the shock wave intensity is enlarged by the effect of geometrical confinement of the plasma and shock wave. The result of cleaning tests using polystyrene particles demonstrates that the particle removal efficiency increases by the effect of geometrical confinement.
机译:已经表明,激光冲击清洗(LSC)工艺对于从固体表面去除纳米级颗粒是有效的,因此在微电子制造中具有各种潜在的应用。在这项工作中,我们提出了一种简单的方法来放大由激光的空气击穿(LIB)产生的冲击波强度。建议的方案采用平面冲击波反射器,该反射器将等离子体的膨胀限制在一个方向上。当LIB感应的冲击波的一半被反射器反射时,沿相反方向传播的冲击波的强度会大大增加。因此,与现有的LSC工艺相比,增强的冲击波可以从表面去除较小的颗粒。从理论和实验两方面分析了几何约束下的LSC过程。等离子体/冲击行为的数值计算表明,平面几何结构的压力放大约为两倍。实验证实,等离子体和激波的几何限制会增大激波的强度。使用聚苯乙烯颗粒进行清洁测试的结果表明,通过几何约束的作用,颗粒去除效率会提高。

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