Technology for Low cost and High Volume Optical Device packaging

摘要

Hybrid integration of optical and electrical components (opt-electronic hybrid integration) leads to great progress in low cost and high volume optical packaging. We have developed various types of opt-electronic hybrid integration Tx/Rx module. Recently, demand for transmission speed is increasing up to 10 Gbps in Metro, LAN networks. A new packaging technique is now requested to realize lower cost and high speed. This paper presents the advance of the opt-electronic hybrid integration technology. A new packaging platform is proposed after revealing the present opt-electronic hybrid integration Tx/Rx module, and the prototype 10G-Ether modules are introduced as a trial.