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Comparative analysis of silicon wafer micromachining versus nonconventional technology

机译:硅片微加工与非常规技术的对比分析

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Abstract: In very large scale of integration processing photolithographic techniques control the patterning of thin film and the deposition of dopant used to make transistor gates and metal contacts. Microelectromechanical systems (MEMS) processing uses the same techniques to create structural components that are essentially submillimeter- sized machines parts. These parts usually require post- fabrication processing or assembly in order to become finished devices. MEMS technology can generally be categorized into two groups as bulk and surface micromachining. These categories respect not only different fabrication processes but different post fabrication techniques for finishing the mechanical subsystem.!0
机译:摘要:在非常大规模的集成处理中,光刻技术可控制薄膜的图案形成以及用于制造晶体管栅极和金属触点的掺杂剂的沉积。微机电系统(MEMS)处理使用相同的技术来创建基本上是亚毫米大小的机器零件的结构部件。这些零件通常需要后期加工或组装才能成为成品。 MEMS技术通常可分为本体和表面微加工两大类。这些类别不仅涉及不同的制造工艺,而且还涉及用于完成机械子系统的后期制造技术。0

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