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A Development of ThermalDriving Shpae Memory Alloy Spring

机译:热驱动形状记忆合金弹簧的发展

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摘要

In this paper, a method caleld as apparent constant elastic modulus was emloyed to design parameters of a SMA spring according to demand of an electronic moisture eliminator, SMF attenuation occurred during operation for the SMA springs made from different TiNi based alloys was analyzed. and the material suitable for making the theraml driving SMA spring was suggested.
机译:本文根据电子除水器的要求,将一种视在恒定弹性模量的方法应用于SMA弹簧的设计参数,分析了不同TiNi基合金制造的SMA弹簧在运行过程中发生的SMF衰减。并提出了适用于制造Theraml驱动SMA弹簧的材料。

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