Design, synthesis and ALD assessment of organometallic precursors for semiconductor applications

摘要

As chip dimensions shrink, the delays in circuits are increasing in a dramatic manner. New challenges are thus arising in processes for scaling and integration, so as to obtain the required performances. This may also include the need of novel transistor architectures, such as FinFET or FD-SOI, at a change of semiconductor node, leading to new material needs. The new associated manufacturing challenges, especially the need to deposit more conformal metallic thin films, can be translated to new opportunities to introduce the usage of organometallic materials in electronic industry. Relevant precursors, reviewed in this paper, are available for ALD processing already, but there is still room for innovation to overcome downscaling challenges. The study of heteroleptic chemistries, e.g. involving the use of different ligands around the metal, is suggested to optimize advantageous physical properties and improved process features, compared to their homoleptic counterparts.