School of Mechatronics Engineering, Harbin Institute of Technology, China;
School of Mechatronics Engineering, Harbin Institute of Technology, China;
Western Digital Corporation, San Jose, USA;
School of Mechatronics Engineering, Harbin Institute of Technology, China,Center for Magnetic Recording Research, University of California, San Diego, USA;
School of Mechatronics Engineering, Harbin Institute of Technology, China;
机译:加载的原子学见解-粘合剂触点的卸载:压入铜基板的刚性球体
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机译:碾压铜基材的刚性球体的分子动力学模拟
机译:通过分子动力学模拟镍基衬底上金薄膜应力演化的原子学机制
机译:谷氨酰胺5-磷杂悬磷酸胺的构象变化两种基板类似物粘合剂:常规分子动力学和加速分子动力学模拟的洞察
机译:铟基热界面材料与铜基体之间金属间化合物的生长:分子动力学模拟