Design and Analysis of Silicon MicroChannel Heat Sink with Varying Cross Sections

摘要

Taguchi robust design method is used to optimize parameters important to the heat dissipation performance of a silicon microchannel heat sink with uniformly varying cross sections. Reduced model for heat transfer analysis of the heat sink is built and key parameters for its heat dissipation performance are identified. Orthogonal experiments are designed and the signal to noise ratios (SNRs) of the average temperature and the uniformity of temperature are calculated to evaluate the heat sink's heat dissipation performance. To reduce design cycle significantly, design and analysis processes are parameterized and automated. Scripts of CAD and CAE software are modified on the fly by a daemon written in the C language and individual processes are created to play these scripts to eliminate human intervention. The main process, the geometrical modeling process (GAMBIT process) and the performance analysis process (FLUENT process) are synchronized through shared files and time delays.