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Antennas on Silicon: Hybrid integration versus SoC solutions?

机译:硅上天线:混合集成与SoC解决方案?

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摘要

Silicon technologies are now competitive with III-V components for applications in the millimeter wave frequencies range, as already demonstrated through fully integrated on-chip systems [1]–[6]. We discuss in this paper of the different thinkable alternative solutions to fully implement efficient antennas within Silicon environment, exploiting either SoC (System on Chip) or SiP (System in Package) approaches depending on the expected performances.
机译:硅技术现在在毫米波频率范围内的应用中与III-V组件竞争,如通过完全集成的片上系统所证明的[1] – [6]。我们在本文中讨论了各种可考虑的替代解决方案,这些解决方案可在SoC环境中完全实现高效天线,并根据预期性能采用SoC(片上系统)或SiP(封装中系统)方法。

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