首页> 外文会议>Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20060425-27; Vancouver(CA) >White Light Interferometry - a production worthy technique for measuring surface roughness on semiconductor wafers
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White Light Interferometry - a production worthy technique for measuring surface roughness on semiconductor wafers

机译:白光干涉测量法-一种有价值的测量半导体晶片表面粗糙度的技术

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摘要

Reproducible, quantitative, and rapid surface roughness measurements would be valuable in many aspects of semiconductor and optical technology - e.g. routine assessment of polished substrates and of epitaxial layers. However, such measurements are rarely made - probably because most measurement techniques avaUable have serious disadvantages in a production environment. In this work we have used white light interferometry to measure a range of semiconductor surfaces. This technique offers many advantages in terms of measurement speed, ease of use, reproducibility and freedom from damage or contamination. The fundamentals of the technique are described and results obtained on a wide range of semiconductor surfaces discussed. Results are shown to be comparable to those obtained by AFM and to show excellent long term reproducibility and stability.
机译:可重现,定量和快速的表面粗糙度测量在半导体和光学技术的许多方面(例如,抛光基材和外延层的常规评估。但是,这种测量很少进行-可能是因为大多数可用的测量技术在生产环境中都存在严重的缺点。在这项工作中,我们使用了白光干涉仪来测量一系列半导体表面。该技术在测量速度,易用性,可重复性以及不受损坏或污染的方面提供了许多优势。描述了该技术的基础,并讨论了在各种半导体表面上获得的结果。结果显示与AFM获得的结果相当,并显示出极好的长期可重复性和稳定性。

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