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THERMAL AND DYNAMICS ANALYSIS OF MENISCUS-CONTROLLED MATERIALS PROCESSING

机译:介子控制材料加工的热力学和动力学分析

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摘要

Fundamental physical processes involved in meniscus-controlled materials processing include meniscus formation and dynamics, movement of solidification interface, and the interaction at the crystal-liquid-vapor tri-junction. Final product shape that can be grown by different techniques depends on the meniscus shape, heat transfer and solidification interface. The fluid flow and heat transfer in the melt and dynamics of meniscus are critical for determining the stable growth conditions for better quality of the grown crystals. In this paper, a theoretical thermal and dynamic model have been developed to describe the heat transfer and dynamics of meniscus and its interaction with solidification. A simplified form of the model will also be developed to allow the investigation of ribbon (or tube) growth that exhibits one-dimensional feature in the most regions. This model will be used to conduct parametric study, and the important process and geometry conditions will be investigated such as the crystal dimension, die-top height, pull rate, and die-top temperature. The dynamic response of meniscus to the potential perturbations during growth such as pull rate and die-top temperature variations, and misalignment between the die and silicon tube will be investigated extensively. From this study, an operating window for stable meniscus will be obtained, and growth procedure that leads to improving the grown crystal quality will be identified.
机译:弯液面控制材料加工中涉及的基本物理过程包括弯液面的形成和动力学,凝固界面的运动以及晶体-液体-蒸汽三结点的相互作用。可以通过不同技术生长的最终产品形状取决于弯液面形状,传热和凝固界面。熔体中的流体流动和传热以及弯液面的动力学对于确定稳定的生长条件以提高晶体的质量至关重要。在本文中,建立了一个理论上的热力学模型来描述弯月面的传热和动力学及其与凝固的相互作用。该模型的简化形式也将被开发出来,以允许研究在大多数区域表现出一维特征的碳带(或管)的生长。该模型将用于进行参数研究,并将研究重要的工艺和几何条件,例如晶体尺寸,芯片顶部高度,拉速和芯片顶部温度。弯月面对生长过程中潜在扰动的动态响应,例如拉速和芯片顶部温度变化,以及芯片与硅管之间的未对准,将得到广泛研究。从这项研究中,将获得稳定弯月面的操作窗口,并将确定导致改善晶体生长质量的生长过程。

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