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Direct-write maskless lithography using patterned oxidation of Si-substrate Induced by femtosecond laser pulses

机译:飞秒激光脉冲诱导的硅衬底图案化氧化的直接写入无掩模光刻

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In this study we report a new method for direct-write maskless lithography using oxidized silicon layer induced by high repetition (MHz) ultrafast (femtosecond) laser pulses under ambient condition. The induced thin layer of predetermined pattern can act as an etch stop during etching process in alkaline etchants such as KOH. The proposed method can be leading to promising solutions for direct-write maskless lithography technique since the proposed method offers a higher degree of flexibility and reduced time and cost of fabrication which makes it particularly appropriate for rapid prototyping and custom scale manufacturing. A Scanning Electron Microscope (SEM), Micro-Raman, Energy Dispersive X-ray (EDX), optical microscope and X-ray diffraction spectroscopy (XRD) were used to evaluate the
机译:在这项研究中,我们报告了一种在环境条件下使用高重复(MHz)超快(飞秒)激光脉冲感应的氧化硅层进行直接无掩模光刻的新方法。预定图案的感应薄层可以在诸如KOH的碱性蚀刻剂的蚀刻过程中充当蚀刻停止层。所提出的方法可以为直接写入无掩模光刻技术带来有希望的解决方案,因为所提出的方法提供了更高的灵活性,并且减少了制造的时间和成本,这使其特别适合于快速原型设计和定制规模的制造。使用扫描电子显微镜(SEM),显微拉曼光谱,能量色散X射线(EDX),光学显微镜和X射线衍射光谱(XRD)来评估

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