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Application of Bias Voltage Control on an Inductively Coupled Plasma EtchSystem for Improved Chamber Matching and Advanced Process Control

机译：偏置电压控制在电感耦合等离子体蚀刻系统上的应用，以改进腔室匹配和先进的过程控制

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《AEC/APC symposium XV》|2003年|1-2|共2页
会议地点 Colorado Springs CO(US);Colorado Springs CO(US)
作者
Cindy Petronis; Roger Patrick;
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作者单位

ST Microelectronics, 1000, East Bell Road, Phoenix, AZ 85022;

Lam Research Corporation, 4650, Cushing Parkway, Fremont, CA 94538;

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原文格式 PDF
正文语种 eng
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1. Controlling VUV photon fluxes in pulsed inductively coupled Ar/Cl2 plasmas and potential applications in plasma etching [J] . Peng Tian, Mark J Kushner Plasma Sources Science & Technology . 2017,第2期

机译：控制脉冲电感耦合AR / CL2等离子体中的VUV光子通量和等离子体蚀刻中的潜在应用
2. Chamber conditioning process development for improved inductively coupled plasma reactive ion etching of GaAs/AIGaAs materials [J] . Michael K. Connors, Jason J. Plant, Kevin G. Ray, Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structure . 2013,第2期

机译：为改善GaAs / AIGaAs材料的感应耦合等离子体反应离子刻蚀而开发的腔室调节工艺
3. Three-dimensional measurements of plasma parameters in an inductively coupled plasma processing chamber [J] . Han Jia, Pribyl Patrick, Gekelman Walter, Physics of plasmas . 2019,第10期

机译：电感耦合等离子体处理室中等离子体参数的三维测量
4. Application of Bias Voltage Control on an Inductively Coupled Plasma Etch System for Improved Chamber Matching and Advanced Process Control [C] . Advanced equipment control / advanced process control symposium . 2003

机译：偏置电压控制在电感耦合等离子体蚀刻系统中的应用，用于改进的腔室匹配和先进过程控制
5. Controlling the relative rates of adlayer formation and removal during etching in inductively coupled plasmas. [D] . Fuller, Nicholas Colvin Masi. 2002

机译：控制在感应耦合等离子体中蚀刻过程中形成和去除涂层的相对速率。
6. Inductively Coupled Plasma Mass Spectrometry as a Reference Method to Evaluate Serum Calcium Measurement Bias and the Commutability of Processed Materials during Routine Measurements [O] . Hai-Jian Zhao, Meng-Lei Ge, Yin Yan, 2018

机译：电感耦合等离子体质谱法作为评估常规测量过程中血清钙测量偏差和加工材料可交换性的参考方法
7. IMPEDANCE MATCHING CONTROLLER FOR AN INDUCTIVELY COUPLED PLASMA CHAMBER L-type Matching Network Automatic Controller [O] . Giorgio Bacelli, John V. Ringwood, Petar Iordanov 2015

机译：用于感应耦合等离子室L型匹配网络自动控制器的阻抗匹配控制器
8. Current and Potential Applications of Inductively Coupled Plasma (ICP)-Atomic Emission Spectroscopy (AES) in the Exploration, Mining, and Processing of Materials [R] . Fassel, V. A. 1976

机译：电感耦合等离子体（ICp） - 原子发射光谱（aEs）在材料勘探，采矿和加工中的现状和潜在应用

Application of Bias Voltage Control on an Inductively Coupled Plasma EtchSystem for Improved Chamber Matching and Advanced Process Control

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