LOW-TEMPERATURE FABRICATION OF HIGHLY LOADED DIELECTRIC FILMS MADE OF CERAMIC-POLYMER COMPOSITES FOR 3D INTEGRATION

摘要

Ceramic-organic composite thick films over 50 vol. % of dielectric powder loading has been fabricated at the temperatures lower than 300℃ using several processing technologies. The objective of this challenge is to overcome the genetic obstacles of conventional ceramics as well as organic technologies in ceramic packaging. The ceramic technology has been confronted with severe shrinkage, brittleness and high temperature processing. The organic based, i.e. PCB technology with FR-4 epoxy also was not free from low dielectric properties and reliability issues, especially at the RF and microwave applications. In this work, ink-jet printing and aerosol deposition method were used in order to form a highly loaded powder packing in the thick film bed, and then low loss organic resins were infiltrated into the dielectric powder packing layer followed by thermal treatment under 300℃ for completely hermetic monolith film. High solid loading of dielectrics with submicron size powders up to 68 vol. % was obtained by ink-jet printing via minimized polymer vehicles and controlled particle shape, size and distribution. Dielectric properties of thus obtained ceramic-organic composite film exhibited dielectric constants of 4.0- 4.6 and Q factors of 248±34 at 1MHz.