Key Laboratory for Precision and Non-traditional Machining of Ministry of Education,Dalian University of Technology, Dalian 116024, P.R. China;
Surface Engineering Laboratory, School of Materials Science and Engineering,Dalian University of Technology, Dalian 116024, P.R. China Venture Business Laboratory (VBL), Ibaraki University,4-12-1 Nakanarusawa, Hitachi 316-8511, Japan;
Key Laboratory for Precision and Non-traditional Machining of Ministry of Education,Dalian University of Technology, Dalian 116024, P.R. China;
Department of Intelligent Systems Engineering, Ibaraki University,4-12-1 Nakanarusawa, Hitachi 316-8511, Japan;
Surface Engineering Laboratory, School of Materials Science and Engineering,Dalian University of Technology, Dalian 116024, P.R. China;
silicon wafers; mechanism; ultra-precision grinding; CMG; XPS; SAGW;
机译:使用软质砂轮(sagw)对硅片进行化学机械研磨(cmg)的材料去除机理
机译:砂轮添加剂对单晶硅晶片化学机械研磨(CMG)的影响
机译:以砂轮为约束的喷砂精加工材料去除机理的分析和实验研究
机译:Si晶片通过软研磨砂轮(SAGW)进行化学机械研磨(CMG)的材料去除机理
机译:电镀CBN砂轮和配对抛光的材料去除模型和预期寿命。
机译:超声振动辅助磨削中C / SiC复合材料去除材料机理的研究
机译:利用软磨料砂轮(saGW)去除si晶片化学机械研磨(CmG)的材料去除机理
机译:用超硬磨料制成的砂轮修整方法