Graduate School, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Graduate School, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Graduate School, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Graduate School, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Venture Business Laboratory (VBL), Ibaraki University,4-12-1 Nakanarusawa, Hitachi 316-8511, Japan;
Department of Intelligent Systems Engineering, Ibaraki University,4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Department of Intelligent Systems Engineering, Ibaraki University,4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Department of Intelligent Systems Engineering, Ibaraki University,4-12-1 Nakanarusawa, Hitachi, Japan 316-8511;
Tokyo Diamond Tools Mfg. Co., Ltd., 2-3-;
design of experiment (DOE); factorial design; chemo-mechanical grinding (CMG); material removal rate (MRR); silicon wafer; insulated bipolar transistor (IGBT);
机译:使用软质砂轮(sagw)对硅片进行化学机械研磨(cmg)的材料去除机理
机译:硅晶片化学机械研磨(cmg)中材料去除率提高的研究
机译:砂轮添加剂对单晶硅晶片化学机械研磨(CMG)的影响
机译:Si晶片化学机械研磨(CMG)材料去除率改善研究
机译:化学机械平面化:摩擦系数,晶片取向和材料去除速率的同步,原位测量。
机译:轨道磨削过程中磨削路径和方向对材料去除行为的影响
机译:利用软磨料砂轮(saGW)去除si晶片化学机械研磨(CmG)的材料去除机理