School of Mechanical Engineering, Inha Univ., 253 Yonghyun-Dong, Nam-Gu, Incheon, Korea;
School of Mechanical Engineering, Inha Univ., 253 Yonghyun-Dong, Nam-Gu, Incheon, Korea;
School of Mechanical Engineering, Inha Univ., 253 Yonghyun-Dong, Nam-Gu, Incheon, Korea;
Department of Mechanical Engineering, Inha Univ., 253, Yonghyun-Dong, Nam-Gu, Incheon,Korea;
si-wafer; box-behnken method; regression analysis; final polishing processing; surface roughness;
机译:最佳抛光条件下硅晶片抛光工艺的统计分析研究
机译:田口和SKD61模具钢磨料射流抛光最佳加工条件的实验研究
机译:机械和化学抛光方法处理的IIa型单晶金刚石的抛光机理和表面损伤分析
机译:Si-晶片抛光工艺统计分析研究最佳抛光条件
机译:统计特征和基于传感器的建模和精细磨料,化学机械抛光过程的监控
机译:实施多标准决策分析(MCDA)对波兰孤儿药物定价和报销过程的潜在影响
机译:用磁流体(FFF)研究GLp(研磨抛光):si晶片的表面抛光特性
机译:波兰果蔬加工机械:市场分析