首页> 外文会议>Advanced gate stack, source/drain , and channel engineering for si-based CMOS 5: New materials, processes, and equipment >UHV Fabrication of the Ytterbium Silicide as Potential Low Schottky Barrier S/D Contact Material for N-Type MOSFET
【24h】

UHV Fabrication of the Ytterbium Silicide as Potential Low Schottky Barrier S/D Contact Material for N-Type MOSFET

机译:UHV硅化Y作为N型MOSFET的潜在低肖特基势垒S / D接触材料

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

Ytterbium silicide provides a low Schottky barrier height to electron on n-type silicon. This property makes this material very attractive for the realization of Source/Drain contacts for n-type MOSFETs. In this communication, the study of structural and electrical properties of YbSi_(2-x) fabricated at different temperature in Ultra-High Vacuum condition without any protective layers is presented. N-type SB-MOSFETs with ytterbium silicide based S/D contacts were fabricated at optimal silicidation temperatures on SOI substrate with an ultra thin body.
机译:硅化为n型硅上的电子提供了低的肖特基势垒高度。这种特性使该材料对于实现n型MOSFET的源极/漏极接触极具吸引力。在此通讯中,介绍了在超高真空条件下,没有任何保护层的情况下,在不同温度下制造的YbSi_(2-x)的结构和电性能的研究。在具有超薄体的SOI衬底上,在最佳硅化温度下,制造了具有基于硅化y的S / D触点的N型SB-MOSFET。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号