Advances in 3D Integrated Circuits

摘要

In this paper, we describe the developments over the past several years in field of 3D integrated circuits. 3D integration offers far greater improvements than traditional semiconductor scaling can provide today. Considered part of the "More Than Moore" category of semiconductor technology, in addition to increasing circuit and system density, 3D integrated circuits can blend a wide range of materials and technologies into a signal polylithic device acting as if these disparate items were truly fabricated together on a single wafer. 3D offers improvement in power, speed, density, cost and reliability, but to access these, new design techniques and system architectures must be used. The paper will review various 3D integration techniques, tool requirements, application of advanced test methodologies, and results.