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Impact of a Cooling Process on the Dopant Activity of Platinum in Silicon

机译:冷却过程对硅中铂的掺杂活性的影响

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In this work we show that the cooling rate following a platinum diffusion strongly influences the electrical conductivity in weakly phosphorus doped silicon. Diffusions were performed at the temperature of 910℃ for 16 hours. Spreading resistance profile analyses clearly show an retype to p-type conversion under the surface when samples are slowly cooled. A compensation of the phosphorus donors is only observed when samples are quenched. This mechanism is reversible. One Pt related deep level located at 0.427 eV is assumed to be at the origin of the type conversion mechanism. Its concentration increases during the cooling step when a low cooling rate is applied. This platinum related acceptor center is likely associated with fast interstitial Pt atoms or intrinsic point defects.
机译:在这项工作中,我们证明了铂扩散后的冷却速度会强烈影响弱磷掺杂硅中的电导率。在910℃的温度下扩散16小时。扩展阻力曲线分析清楚地表明,当样品缓慢冷却时,表面下会发生从重塑到p型的转化。仅当样品淬灭时才能观察到磷供体的补偿。这种机制是可逆的。类型转换机制的起源被认为是一个位于0.427 eV的与Pt有关的深能级。当施加低冷却速率时,其浓度在冷却步骤期间增加。这种与铂有关的受体中心可能与快速填隙的Pt原子或本征点缺陷有关。

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