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Change of the Sputtering Voltage during the Preparation of Vanadium Oxide Thin Films

机译:氧化钒薄膜制备过程中溅射电压的变化

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Vanadium oxide thin films were deposited on P(100) silicon substrates with silicon nitride thin film layer by DC reactive magnetron sputtering method. Changes of the sputtering voltage in a certain flux of Ar gas and different flux ratio of Ar/O2 mixed conditions were studied. X-ray Photoelectron Spectroscopy (XPS) was performed to analyze the V/O ratio of the vanadium oxide thin films deposited. Square resistance (R□) and temperature coefficient of square resistance (TCR) of the thin films were examined. Surface morphology was visualized by atomic force microscope (AFM). Experiments demonstrate that the sputtering voltage has different change tendency in different gas conditions and the results revealed that V/O ratios of vanadium oxide thin films can be controlled by precisely control the sputtering voltage.
机译:通过直流反应磁控溅射方法,在具有氮化硅薄膜层的P(100)硅基板上沉积氧化钒薄膜。研究了一定Ar气流量和不同Ar / O2混合条件下的溅射电压变化。进行X射线光电子能谱(XPS)分析沉积的钒氧化物薄膜的V / O比。检查了薄膜的方电阻(R□)和方电阻温度系数(TCR)。通过原子力显微镜(AFM)观察表面形态。实验表明,溅射电压在不同的气体条件下具有不同的变化趋势,结果表明,通过精确控制溅射电压可以控制钒氧化物薄膜的V / O比。

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