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A high-performance vibratory silicon microgyroscope

机译:高性能振动硅微陀螺仪

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摘要

Design, fabrication, and preliminary testing of a high-performance vibratory polysilicon ring gyroscope are presented. A high aspect-ratio p++/polysilicon trench-refill technology has been used to realize 35 um thick polysilicon ring structure with 0.9 mu m ring-to-electrode gap-spacing. The theoretical noise analysis of the ring gyroscope shows that by taking advantage of the submicron ring-to-electrode gap spacing, high aspect ratio thick polysilicon ring structure produced using deep dry-etching and high quality factor of polysilicon, vibrating ring gyroscopes with random walk as small as 0.4 deg/ h~(1/2) can be realized. 80 mu m thick trench-refilled polysilicon ring structures have shown a measured quality factor of 6000 under vacuum.
机译:介绍了高性能振动多晶硅环形陀螺仪的设计,制造和初步测试。高纵横比的p ++ /多晶硅沟槽再填充技术已被用于实现35微米厚的多晶硅环结构,环电极间隙为0.9微米。环形陀螺仪的理论噪声分析表明,利用亚微米环形电极间隙,利用深干法刻蚀生产的高长宽比厚的多晶硅环结构以及多晶硅的高品质因数,可随机行走的振动环形陀螺仪可以实现小至0.4度/ h〜(1/2)。 80微米厚的沟槽填充多晶硅环结构在真空下的质量系数为6000。

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