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The potential of sulfur dioxide treatment to lower radiata pine TMP energy demand

机译:二氧化硫处理降低辐射松TMP能源需求的潜力

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Pretreating radiata pine chips with sulfur dioxide (SO_2) gas was found to reduce the energy required to produce refiner mechanical pulp of a given freeness provided relatively high application rates in the range 2-4% (w/w) were used. This reduction in refining energy was achieved without any adverse effects on the pulp strength and optical properties. Lower application rates in the range 0.5-1.0% (w/w) were not effective in reducing the energy demand.rnThe chip preheating temperature was found to have a major influence on the effectiveness of the SO_2 treatment. Energy reductions of 8-9% were obtained when 2-4% SO_2 application rates were used to pretreat chips in a PRMP pulping system that involved atmospheric chip presteaming (90℃) prior to pressurised refining. In this system most of the applied SO_2 gas did not appear to react with the fibre until the chips entered the refining operation. In contrast, when the SO_2 gas was applied ahead of the pressurised chip preheating operation (125℃) in a conventional TMP system, all the SO_2 gas was consumed during chip preheating and only a marginal reduction in refining energy was obtained with a high, 4% SO_2 application rate.rnThese findings indicate that it may be more effective to use SO_2 as an in-refiner treatment than as a chip pretreatment. However, based on the current costs of electricity and SO_2 gas, application rates in the range 2-4% would not be cost effective for a commercial PRMP pulping operation.
机译:如果使用2-4%(w / w)范围内的相对较高的施用率,发现用二氧化硫(SO_2)气体预处理辐射松片可以减少生产给定游离度的磨浆机机械纸浆所需的能量。实现了精制能量的降低,而对纸浆强度和光学性能没有任何不利影响。在0.5-1.0%(w / w)范围内较低的施用率并不能有效地降低能量需求。研究发现,芯片预热温度对SO_2处理的效果有重大影响。当使用2-4%SO_2施用量对PRMP制浆系统中的切屑进行预处理时,可实现8-9%的能耗降低,该系统包括在加压精炼之前进行常压切屑预蒸(90℃)。在该系统中,直到切屑进入精炼操作之前,大多数施加的SO_2气体似乎都不会与纤维发生反应。相反,在常规TMP系统中,在加压切屑预热操作(125℃)之前施加SO_2气体时,所有SO_2气体在切屑预热过程中都被消耗掉,而精炼能量的边际降低却高达4%。这些发现表明,将SO_2用作磨浆机内处理比使用芯片预处理更为有效。但是,基于当前的电力和SO_2气体成本,2-4%的施用率对于商业性的PRMP制浆操作而言并不划算。

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