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STUDY ON THE STATE RECOGNITION OF THE IC COMPONENTS IN PACKING

机译:包装中IC组件的状态识别研究

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摘要

In the IC components' packing, the accuracy of the components' position and right face are required. In order to assure the IC component' proper state, the fast recognition of the IC components is an important technique. Through analyzing all kinds of IC components, a recognition algorithm based on their feature was proposed. Transforming the image recognition into finding the feature in the sampling image greatly simplifies the online recognition of the IC Components. Some useful parts can be extracted from the image by image preprocessing and partition. Then the locating point based on the feature of the IC component could be found. Finally whether the component is in proper state could be told. In this paper, the design of the recognition algorithm was studied, and the recognition program flow chart was presented.
机译:在IC组件的包装中,要求组件位置和右表面的精度。为了确保IC组件的正常状态,快速识别IC组件是一项重要技术。通过分析各种IC元件,提出了一种基于特征的识别算法。将图像识别转变为在采样图像中找到特征,可以大大简化IC组件的在线识别。可以通过图像预处理和分区从图像中提取一些有用的部分。然后可以找到基于IC组件特征的定位点。最后,可以告知组件是否处于正确状态。本文研究了识别算法的设计,并给出了识别程序流程图。

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