Micro Machined Relay with Vertical Feed Through and Wirebond-Less Package

摘要

High frequency characteristics of micro machined relay (MMR) in various packages are evaluated. With a horizontal feed through structure, insertion loss of 0.20dB and isolation of 41.5dB at 2GHz are obtained, however, the loss increased to 0.48dB in a plastic mold package. In order to improve the characteristics, especially low insertion loss even in package, a novel MMR structure is designed. The new designed relay has vertical feed through, to eliminate wire bonding, like flip-chip assembly. On the basis of CAE simulation, the vertical feed through MMR (VMMR) promises lower loss, less than 0.20dB at 2GHz.