Vacuum Micro-electroforming Technique for the Production of Void-free Microcomponent

摘要

Pinhole defect in the deposit is one of the ticklers which have not yet been solved fundamentally when micro-electroforming nickeI into high-aspect-ratio(HAR) micro-molds．To obtain void-free micro-components，a new microelectroforming technique，which was carried out under the complex circumstance of vacuum．degassing and temperature．gradient．was developed in this paper．Mechanisms of this micro．electroforming process were introduced using graphic and simulation methods．To investigate the feasibility of the exploited technique，a series of experiments were performed using special equipment developed by authors，followed by the evaluating of surface morphology ofnickel micro-electroforms using a scanning electron microscope(SEM)．Experimental results showed that，comparing with the conventional electroforming practices，a significant reduction in pinhole defects ofthe samples electroformed by the hovel process was achieved．