Evolution of bond technology to hybridized process flows

摘要

Wafer level bonding has emerged from the MEMS industry as a major enabling technology for 3D IC integration. The transition from a low volume MEMS manufacturing environment with many customized processes to a highly standardized, high volume CMOS based manufacturing process flow has forever changed wafer level bonding. Equipment and hardware changes are necessary to meet throughput expectations and reliability standards that far exceed those of low volume manufacturing. In addition, wafer bonding technology has evolved to secure submicron alignment precision with process techniques that are compatible with the cleanliness and contamination requirements of the IC industry.