首页> 外文会议>31th European Solid-State Device Research Conference, Sep 11-13, 2001, Nuremberg, Germany >Carbon Implanted Halo for Super Halo Characteristic NFETs in Bulk and SOI
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Carbon Implanted Halo for Super Halo Characteristic NFETs in Bulk and SOI

机译:用于散装和SOI中超级光晕特性NFET的碳注入光晕

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摘要

For high performance deep sub .08um CMOS technologies, minimizing short channel effect (SCE) can result in significant improvements in nominal device performance. We show that with carefully chosen carbon implants in the NFET extension and halo region, superior halo performance is achievable. This "Super Halo" characteristic, results in an improvement in SCE and a subsequent Improvement in Idsat. The carbon implants are placed to reduce the transient diffusion of the boron halo (TED) while not extending deep enough to become a dominant source of leakage. The net is an improved device characteristic resulting in an equivalent performance gain of 80uA/um at nominal with the same Ioff at minimum for both bulk CMOS and SOI technologies.
机译:对于高性能的.08um以下CMOS技术,最小化短沟道效应(SCE)可以显着改善标称器件性能。我们表明,通过在NFET扩展区和光环区域中精心选择的碳注入物,可以实现出色的光环性能。这种“超级光环”特性导致SCE的提高,以及Idsat的后续提高。放置碳植入物可减少硼卤化物(TED)的瞬态扩散,同时延伸的深度不足以成为主要的泄漏源。该网是一种改进的器件特性,在批量CMOS和SOI技术中,在等效条件下的额定Ioff值等效增益为80uA / um。

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