首页> 外文会议>2nd International Conference on Advanced Materials Processing; Dec 2-4, 2002; Singapore >The Use of Modern Microscopic Techniques in Evaluation of Polyphthalamide and Polybutylene Terephthalate Injection Moulded Parts for Electroless Plating
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The Use of Modern Microscopic Techniques in Evaluation of Polyphthalamide and Polybutylene Terephthalate Injection Moulded Parts for Electroless Plating

机译:现代显微镜技术在化学镀用聚邻苯二甲酰胺和聚对苯二甲酸丁二酯注塑件评估中的应用

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摘要

In this paper, two industrially utilized polymers are examined with selected microscopic techniques. The morphology of commercially available, high performance polyphtalamide (PPA) composite as well as polybutylene terephtalate (PBT) composite both used as a base material for electroless plating was a subject of the study. The samples used were two-shot moulded interconnecting devices (MIDs). The polymers and their surfaces was studied during different stages of the plating process. Scanning Probe Microscopy (SPM) and Scanning Electron Microscopy (SEM) were utilised to reveal the morphological changes of the material during various stages of the chemical treatment and for the untreated specimens. For both materials, large volume additives - such as glass-fibres were observed to be oriented in the injection-flow direction. Smaller size additives, were distributed homogeneously down to the sub-micron level. The plating process resulted in the formation of a thick, porous layer on the PPA polymer surface. The surface of PBT was less affected. A metal layer (copper) formation process on the treated composite surfaces was different for PBT and PPA due to a different method used to introduce the catalyst into the system.
机译:在本文中,通过选择的微观技术检查了两种工业应用的聚合物。本研究的主题是市售的高性能聚邻苯二甲酰胺(PPA)复合材料以及聚对苯二甲酸丁二醇酯(PBT)复合材料,它们均用作化学镀的基础材料。所使用的样品是两次注塑成型的互连设备(MID)。在电镀过程的不同阶段研究了聚合物及其表面。利用扫描探针显微镜(SPM)和扫描电子显微镜(SEM)揭示了化学处理各个阶段以及未经处理的样品的材料形态变化。对于这两种材料,观察到大量添加剂(例如玻璃纤维)在注射流方向上取向。较小尺寸的添加剂均匀分布至亚微米水平。电镀过程导致在PPA聚合物表面上形成厚的多孔层。 PBT的表面受影响较小。对于PBT和PPA,在处理后的复合材料表面上形成金属层(铜)的过程有所不同,这是因为将催化剂引入系统的方法不同。

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