INITIATION OF INTERFACIAL DELAMINATIONS RELAVANT TO FLIP-CHIP ASSEMBLIES

摘要

The ADCB and TBJ results for monotonic adhesion testing correlate well, indicating that similar interfacial interactions play a part in both tests. The preliminary fatigue TBJ results show a linear trend under low cycle fatigue, with future testing to encompass higher cycle fatigue. Continued initiation testing will be done on other butt joint geometries (corner, embedded edge, and embedded corner singularity types) as well as flip-chip type geometries that will be tested under both thermal and mechanical fatigue conditions