A Coupled Thermal-Structural Nip Analysis of Thermal Dye Transfer Printing

摘要

A coupled two-dimensional thermal-structural nip analysis using a commercially available finite element package, i.e., ABAQUS, has been developed to simulate the thermal dye transfer (TDT) printing process. Incorporating all key components in the thermal printing process, this simulation model includes a simplified printhead, the layered structure of a thermal media pair, i.e., dye donor ribbon and receiver, and the elastomer-covered platen roller. The unique feature in this simulation is its capability of simultaneously solving the structural and contact mechanism of the approaching surfaces during thermal printing and calculating the heat transfer through these interfacial contacts. During the simulation, the model mimics the movement of the dye donor ribbon and receiver, which are brought into intimate contact between the printhead and the platen roller. Thermal energy or heat generated by pulsing the heating elements in the printhead flows through the media and across interfacial contact pairs, e.g., printhead and dye donor ribbon, and dye donor ribbon and receiver (where the dye diffusion occurs). The contact area and contact pressure at the interfaces, temperature distribution, thermal history, and stress-strain state are all calculated for each component. The model has been successfully implemented to investigate the effects of platen rollers, to study the media and equipment interactions, and to help identify essential material properties for media design.