首页> 外文会议>20th Capacitor and Resistor Technology Symposium, 20th, Mar 6-10, 2000, Huntington Beach, California >Specifications and Test Methods of Ceramic Multilayer Capacitors with Ultrathin Dielectric Layers
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Specifications and Test Methods of Ceramic Multilayer Capacitors with Ultrathin Dielectric Layers

机译:具有超薄介电层的陶瓷多层电容器的规格和测试方法

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摘要

Present state-of-the-art MLCC technology makes it possible to realise capacitors with dielectric thickness down to 2 μm These advanced products, focussing on high-capacitance (above 1μF) and low voltage applications (below 10V), are competing with Tantalum or dry Aluminium electrolytic capacitors. Not only the physical characteristics, but also the specifications and test methods differ in many aspects between ceramic dielectrics and electrolytic capacitors, making it increasingly difficult to the compare product performances. Developments of advanced Tantalum capacitors and MLCC's with ultra thin dielectrics lead to adaptations of specifications. International standardisation organisations (IEC, EIA, EIAJ) face difficulties in updating specifications at the speed of new developments. Moreover, specification guidelines continue to be technology related in stead of application related. Guidelines for specifying capacitors related to the application should be developed. This contribution will outline some of these important application related properties of advanced multilayer ceramic capacitors in comparison with Tantalum capacitors. Suggested for new specifications methods and product opportunities based on application based specifications will be presented.
机译:当前最先进的MLCC技术使得可以实现介电厚度低至2μm的电容器。这些先进产品侧重于大电容(1μF以上)和低压应用(10V以下),正在与钽或钽电容器竞争。干铝电解电容器。陶瓷电介质和电解电容器不仅在许多方面都有物理特性,而且规格和测试方法也有所不同,这使得比较产品性能变得越来越困难。先进的钽电容器和具有超薄电介质的MLCC的发展导致对规格的适应。国际标准化组织(IEC,EIA,EIAJ)在以新的发展速度更新规范方面面临困难。而且,规范指南继续与技术有关,而不是与应用有关。应制定指定与应用有关的电容器的指南。与钽电容器相比,这项贡献将概述高级多层陶瓷电容器的一些与应用相关的重要特性。将提出针对新规格的建议方法和基于基于应用规格的产品机会。

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