A review is presented of the methods and test techniques used to determine the elastic and mechanical properties of ceramic chip capacitors, both in single layer and multilayer configuration. As these devices are subject to ever-more-rigorous stresses in their testing, packaging, substrate mounting and use, determination of their ability to survive these thermomechanical stresses has become necessary. Bend tests, laminate bond strength tests, ultrasonic determination of elastic moduli and Poisson's ratios, thermal shock resistance, and microhardness determination of fracture toughness parameters are all reviewed and compared, both for their rigor and capabilities and for their ability to directly relate to stresses of concern to part users.
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