首页> 外文会议>2018 International Conference on Communications and Electrical Engineering >Role of High-K and Gate Engineering in Improving Rf/Analog Performances of In 0.2 Ga0.8As/Al0.3Ga0.7As HEMT
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Role of High-K and Gate Engineering in Improving Rf/Analog Performances of In 0.2 Ga0.8As/Al0.3Ga0.7As HEMT

机译:高K和栅极工程在提高In 0.2 Ga0.8As / Al0.3Ga0.7As HEMT的Rf /模拟性能中的作用

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摘要

This work deals with the potential benefit of double gate field plate MOS-HEMT using Si3N4 as high-K for RF and analog applications. Analog and RF performances investigation is done using 2D Silvaco TCAD for a wide range of gate voltage (VGS). The designed device shows better performances in terms of drain current (Id), cutoff frequency (fc), trans conductance (gm) in contrast to the conventional Recessed Gate Pseudomorphic HEMT (RGP HEMT). However, a reduced trans conductance generation factor (gm/Id) is noticed. Simulation results are satisfactory and a drain current of 460 μm, a maximum gain of 447 dB, a peak gm of 4.22 ms/μm, and 520 GHz for fC are obtained. The efficiency of the proposed design is highlighted for high power and high-frequency applications.
机译:这项工作解决了使用Si3N4作为高K的双栅极场板MOS-HEMT在RF和模拟应用中的潜在优势。使用2D Silvaco TCAD对广泛的栅极电压(V \ n GS \ n)。设计的器件在漏极电流(Id),截止频率(fc),跨导(g \ n m \ n),与传统的隐式门伪形HEMT(RGP HEMT)相反。然而,注意到降低的跨导产生因子(gm / Id)。仿真结果令人满意,并且获得了fC的漏极电流460μm,最大增益447 dB,峰值gm为4.22 ms /μm和520 GHz。对于高功率和高频应用,该设计方案的效率得到了强调。

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