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Role of High-K and Gate Engineering in Improving Rf/Analog Performances of In 0.2 Ga0.8As/Al0.3Ga0.7As HEMT

机译:高k和门工程在提高 0.2 GA0.8AS / AL0.3GA0.7AS HEMT中的RF /模拟性能方面的作用

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This work deals with the potential benefit of double gate field plate MOS-HEMT using Si3N4 as high-K for RF and analog applications. Analog and RF performances investigation is done using 2D Silvaco TCAD for a wide range of gate voltage (VGS). The designed device shows better performances in terms of drain current (Id), cutoff frequency (fc), trans conductance (gm) in contrast to the conventional Recessed Gate Pseudomorphic HEMT (RGP HEMT). However, a reduced trans conductance generation factor (gm/Id) is noticed. Simulation results are satisfactory and a drain current of 460 μm, a maximum gain of 447 dB, a peak gm of 4.22 ms/μm, and 520 GHz for fC are obtained. The efficiency of the proposed design is highlighted for high power and high-frequency applications.
机译:这项工作涉及双栅极板MOS-HEMT的潜在益处,使用Si3N4作为RF和模拟应用的高k。使用2D Silvaco TCAD进行模拟和RF性能调查,用于宽范围的栅极电压(V. gs )。设计的装置在漏极电流(ID),截止频率(FC),反式电导(G)方面表现出更好的性能 m 相反,与传统的凹陷栅极伪斑纹(RGP HEMT)相反。但是,注意到减少的跨导产生因子(GM / ID)。仿真结果令人满意,漏极电流为460μm,获得447dB的最大增益,4.22ms /μm的峰Gm,以及Fc的520GHz。提出设计的效率突出显示了高功率和高频应用。

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