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Acceleration insensitive hemispherical shell resonators using pop-up rings

机译:使用弹出环的对加速度不敏感的半球形壳谐振器

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This work introduces DICE (Deep Isotropic Chemical Etching) process for fabrication of highly symmetric 3D Hemispherical Shell Resonators (HSR) based on HNA etching of <;111> silicon using a pop-up ring mask. The proposed method is used to fabricate 650 nm thick SiOn2nhemispherical shell with a diameter of 180 μm, demonstrating a 3D symmetry of 99%. The quality factor (Q) of the wine glass n=2 mode is measured as 31542 at 100 kHz with a frequency mismatch of 512 Hz (Δf/fnrn=0.5%) between the two n=2 degenerate modes. COMSOL simulations show that a symmetric shell resonator has simultaneous shock insensitivity to in-plane and out-of-plane acceleration.
机译:这项工作介绍了DICE(深度各向同性化学蚀刻)工艺,该工艺基于弹出式环形掩模对<; 111>硅进行HNA蚀刻,用于制造高度对称的3D半球形壳谐振器(HSR)。所提出的方法用于制造650 nm厚的SiOn 2 半球壳,直径为180μm,表明3D对称性为99%。酒杯n = 2模式的品质因数(Q)在100 kHz时测量为31542,频率不匹配为512 Hz(Δf/ fn r n = 0.5%)在两个n = 2简并模式之间。 COMSOL仿真表明,对称壳谐振器同时具有对平面内和平面外加速度的冲击不敏感性。

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