首页> 外文会议>2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits >The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM
【24h】

The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

机译:电子辐射对通过SEM,FIB和TEM进行的半导体失效分析的影响概述

获取原文
获取原文并翻译 | 示例

摘要

The paper briefly overviewed electron-beam radiation damage and its impacts on physical failure analysis by SEM, FIB and TEM. Based on our electron radiation study on some typical electron-beam sensitive materials, we discussed some interesting results associated with electron radiation damage to Lk/ULK, silicon nitride and CoFeB thin film materials in semiconductor and MRAM devices. The details included radiation induced microstructure changes., material diffusion and phase transformation. The underlying mechanism was also briefly discussed for electron radiation damage to different materials.
机译:本文简要概述了电子束辐射损伤及其对通过SEM,FIB和TEM进行的物理失效分析的影响。基于对某些典型电子束敏感材料的电子辐射研究,我们讨论了一些与电子辐射损坏半导体和MRAM器件中的Lk / ULK,氮化硅和CoFeB薄膜材料有关的有趣结果。细节包括辐射引起的微观结构变化,材料扩散和相变。还简要讨论了电子辐射损坏不同材料的潜在机理。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号