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To improve the measure fail rate On SEM through six sigma DMAIC methodology — Chien-Hui Lu

机译:通过六西格玛DMAIC方法提高SEM的测量失败率-卢建辉

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A Critical Dimension SEM (CD-SEM: Critical Dimension Scanning Electron Microscope) is a dedicated system for measuring the dimensions of the fine patterns formed on a semiconductor wafer. CD-SEM is mainly used in the manufacturing lines of electronic devices of semiconductors. The measurement process includes OM Alignment, SEM Alignment, Addressing, Measurement, and Image Saved. From May 2015, we found CD-SEM measure fail rate (measured by S-9380 SEM) is too high (its point reject rate is 46.13%). High measure fail rate will reduce the equipment capacity utilization, and increase manufacturing costs. So, we apply six-sigma DMAIC methodology to improve CD SEM fail rate that is our primary task, this is big Y. According to entitlement rules, we make a target to improve CD SEM fail rate from 46.13% to 15.4%. Drilling down CD SEM fail ERR (Error code reject rate) and analyze the data, the most of measurement errors are in addressing code (9007) =43.731%. We choice addressing code (9007) improvement as our small y. To improve this problem, the Six Sigma approach of DMAIC (Define, Measure, Analyze, Improve, Control) is deployed on this project. There are several tools applied in this process improvement, such as SIPOC, Detailed Map, Cause & Effect Matrix analysis, ANOVA, and DOE. Initial investigation indicates several factors in addressing of Photo process contribute this measurement fail phenomenon. By Cause & Effect Matrix, several factors are clarified as most possible root causes, they are X1:Magnification, X2: Algorithm, X3: Kind, and X4: Method. After the statistical comparisons, X1: Magnification and X4: Method are significant & important factors. DOE is conducted to figure out the optimized process control conditions and the results showed significant difference from original conditions. With such implementation, the CE-SEM measurement fail rate is improved from 46.13% to 1%. The total benefits lead to 39 million cost saving! It is a good practice to proceed continuously the quality improvement with Six Sigma Methodology for other defect improvement in the future.
机译:临界尺寸SEM(CD-SEM:临界尺寸扫描电子显微镜)是用于测量形成在半导体晶片上的精细图案的尺寸的专用系统。 CD-SEM主要用于半导体电子设备的生产线。测量过程包括OM对齐,SEM对齐,寻址,测量和图像保存。从2015年5月开始,我们发现CD-SEM测量失败率(通过S-9380 SEM测量)过高(其点拒绝率为46.13%)。较高的措施失败率会降低设备容量利用率,并增加制造成本。因此,我们采用六西格玛DMAIC方法来提高CD SEM失败率是我们的首要任务,这是一个很大的任务。根据授权规则,我们制定了将CD SEM失败率从46.13%提高到15.4%的目标。向下钻取CD SEM失败ERR(错误代码拒绝率)并分析数据,大多数测量错误在寻址代码(9007)= 43.731%中。我们选择改进地址代码(9007)作为我们的y。为了改善此问题,在该项目上部署了DMAIC的六西格码方法(定义,测量,分析,改进,控制)。在此过程改进中应用了多种工具,例如SIPOC,详细地图,因果矩阵分析,ANOVA和DOE。初步调查表明,解决Photo过程的几个因素导致了此测量失败现象。通过因果矩阵,明确了几个因素,它们是最可能的根本原因,它们是X1:放大倍率,X2:算法,X3:种类和X4:方法。经过统计比较,X1:放大倍率和X4:方法是重要的重要因素。进行了DOE,以找出最佳的过程控制条件,结果表明与原始条件有显着差异。通过这种实施方式,CE-SEM测量失败率从46.13%提高到1%。总收益可节省3900万美元的成本!良好的做法是,在将来继续采用六西格玛方法进行质量改进,以进行其他缺陷改善。

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