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Phosphorus: An ultra low footprint and energy consumption 3D NoC architecture

机译:磷:超低占地面积和能耗的3D NoC架构

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Thermal and energy consumption constitute a major problem in 3D NoC (Network on Chip) implementation. A considerable part of the energy consumed by an MPSoC is dissipated by the interconnect itself. Moreover, latency and routing complexity could introduce an unacceptable hindrance to the NoCs performances if conventional energy reduction techniques such as VFS (Voltage and Frequency Scaling) are used. We introduce a novel low-radix router based 3D NoC architecture that reduces both energy (≃ 26%) consumption and the interconnects area ≃ 40%) without causing a considerable performance loss (8.31% latency, 14.68% throughput for 48 nodes) compared to 4×4×3 3D Mesh network.
机译:在3D NoC(片上网络)实施中,热量和能量消耗是一个主要问题。 MPSoC消耗的相当一部分能量是由互连本身耗散的。此外,如果使用传统的节能技术(例如VFS(电压和频率缩放)),则延迟和路由复杂性可能会对NoC性能造成不可接受的障碍。我们引入了一种新颖的基于低基数路由器的3D NoC架构,与之相比,它既减少了能耗(约26%),又减少了互连面积约40%),而不会造成明显的性能损失(8.31%的延迟,48个节点的吞吐量为14.68%)。 4×4×3 3D Mesh网络。

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