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ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications

机译:面向物联网应用的硅芯片的低泄漏ESD保护设计

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On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2∼3nA), low trigger voltage (∼2V), high ESD robustness (>8kV), and free to latchup issue.
机译:提出了针对物联网应用的硅芯片的低泄漏考虑的片上静电放电(ESD)保护设计。拟议的ESD保护设计使用快速导通的可控硅整流器(SCR)器件来实现电源导轨ESD钳位电路。经台积电28nm CMOS工艺验证的实验结果表明,该设计具有低漏电流(2〜3nA),低触发电压(〜2V),高ESD鲁棒性(> 8kV)和无闩锁的优点。

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