Bumping UBM metal residue defect analysis and improvement using techniques of design of experiment (DOE)

摘要

Design of experiments (DOE) is a systematic method used to determine the relationship between the factors that affect a process and the output of that process. In other words, it is used to find cause and affect relationships. This information plays an essential role in managing process inputs in order to optimize the output. By manipulating multiple inputs at the same time, design of experiments is a useful tool for determining specific factors that affect defect levels in a product as well as identifying the potential factor. It has been practiced in numerous business segments including services, manufacturing, healthcare, defense, agricultural and public service. This study investigates the determinants that affect the bumping (a process of semiconductor front-end assembly) UBM metal residue defect, using the design of experiment technique. Data were collected; using face to face interviews at a semiconductor company. The test research is analyzed using Minitab 17. The result shows that etching time has the most significant influence upon the bumping UBM metal residue. The contour plot explores the relationship between the bumping UBM metal residue and the interaction of two variables.